LOW PRESSURE OVERMOLDING
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Used to encapsulate electronic components, Low Pressure Molding (LPM) technology serves an important role in protecting and sealing items against moisture, dust, dirt, and debris. Simplified to a single, fast process, LPM is a cross between classic plastic injection and resin potting and is ideal for connectors, onboard electronics, LEDs, and PCBs (Printed Circuit Boards).
LOW PRESSURE MOLDING PRODUCT EXAMPLE
THERMELT LPM MATERIALS
The Thermelt polyamide hot melts range includes multipurpose products with easy processability and high resistance in harsh environments. Most are available in black and natural colors. Get in touch and let us recommend a suitable Bostik Thermelt LPM material solution.
| Product | Operating Range (°C) | Shore Hardness (ISO 868) | Softening Point (°C) (ASTM D3461) | Typical Characteristics |
|---|---|---|---|---|
| Thermelt 861 | -40°C to 125°C | 38D | 160°C ±5°C | General purpose moldable polyamide with good adhesion for industrial applications. |
| Thermelt 867 | -40°C to 150°C | 45D | 183°C ±5°C | High performance moldable polyamide with good adhesion and thermal shock resistance. |
| Thermelt 866 | -25°C to 115°C | 21D | 155°C ±5°C | Excellent adhesion to PES, PC, and other demanding substrates. |
| Thermelt 817R | -15°C to 125°C | 49D | 170°C ±5°C | Low application viscosity for demanding designs. |
| Thermelt 868 | -40°C to 125°C | 39D | 160°C ±5°C | Very good UV and moisture resistance. |
| Thermelt 858 | -40°C to 150°C | 49D | 180°C ±5°C | Excellent thermal stability. |
| Thermelt 865 | -55°C to 120°C | 31D | 157°C ±5°C | Good low-temperature resistance. |
| Thermelt 892 | -20°C to 140°C | 53D | 173°C ±5°C | Increased strength for industrial electronics. |
| Thermelt 195 | -20°C to 150°C | 56D | 200°C ±5°C | Excellent thermal stability for overmolding. |
| Thermelt 861 HV | -40°C to 125°C | 22D | 160°C ±5°C | High-end moldable polyamide. |
| Thermelt 867 HV | -40°C to 150°C | 32D | 182°C ±5°C | Good adhesion with strong internal cohesion. |
REACTIVE POLYAMIDES (PAR)
Able to be applied at low temperatures like standard moldable polyamides, PAR hot melts use regular LPM equipment coupled with a specific drum or bulk meter. They cure after application to form a cross-linked network that provides superior temperature resistance up to 200°C. PARs enable LPM to be used in demanding applications that require temperature resistance of 150°C to 200°C, such as in automotive component assembly.
| Product | Operating Range (°C) | Shore Hardness (ISO 868) | Softening Point (°C) (ASTM D3461) | Typical Characteristics |
|---|---|---|---|---|
| PAR 1000 | -40°C to 200°C | 37D | 161°C ±5°C | Reactive moldable polyamide with very high temperature resistance, mainly used for electronic/electrical components, connectors, and cables for automotive applications. |
| PAR 1002 | -55°C to 200°C | 20D | 144°C ±5°C | Reactive moldable polyamide with very high and low temperature resistance, mainly used for electronic/electrical components, connectors, and cables for automotive applications. |
BENEFITS OF LOW PRESSURE MOLDING
Process
SMALL PROCESS FOOTPRINT
Lower energy consumption due to low injection pressure and need for less equipment.
HIGH PRODUCTION SPEEDS
Reduced cycle times with one-component product, immediate set with no mixing errors.
EASIER MANUFACTURING
Simplified process with only three steps.
Product
DELICATE ENCAPSULATION
Suitable for the most sensitive electronic components.
HIGH RESISTANCE
Water tight, UL94 V0 approved, resistant to high temperatures, shocks, harsh environments, and solvents.
QUALITY DESIGN
Lightweight, slim-lining and aesthetically pleasing design; no housing needed.
Sustainability
ZERO WASTE
Recyclable excess material and long shelf life.
NATURAL MATERIAL
Solvent-free, bio-based up to 80%.
RECYCLABILITY
Improved end-of-life management.
LPM POLYAMIDE HOT MELTS PRODUCTS
General Purpose
Improved Mechanical Properties
Resistance to Harsh Environments
Adhesion to Difficult
Substrates
Substrates
PAR Reactive
Polyamide
Polyamide
Application
Excellent Heat
Resistance
Resistance
Cold Resistance
Good
Excellent
Unique technology!
Excellent heat resistance
Excellent heat resistance