Electronics manufacturing is central to what we do here at thermelt.com, and as an exclusive distributor of Bostik’s Thermelt LPM materials, our relationship runs deeper. This gives us access to Bostik’s portfolio of smart adhesives, designed specifically for electronics and industrial manufacturing.
Take advantage of our extensive range, simplify your manufacturing supply chain and make the shift to state-of-the-art, class leading products that elevate your product’s performance, giving it impact that is sure to stick.
To gain an understanding of the capabilities of the diverse Born2Bond range of adhesives and their applications, take a look at the following VR Headset assembly example which shows the breadth of adhesive systems in use within this complex electronics product.
Scan the QR Code for an animated fly-through of this assembly.
CONTACT US TO ENQUIRE ABOUT ANY OF THE BOSTIK BORN2BOND RANGE
INSTANT ADHESIVES
Born2Bond Instant Adhesives portfolio is diverse, ranging from 1K solutions, through 2K mixing solutions and UV curing formulations.
Polytec PT Epoxy resins and Potting Compounds
Epoxy resin adhesives and potting compounds for applications in electronics, electrical engineering, optics and medical technology.
HMPUR
Advancements in production processes and trends such as miniaturization have made hot melt polyurethane reactive (HMPUR) solutions more important than ever. This is especially true of the electronic device sector, where precision, durability and speed of application are essential.
For more information on any Bostik Born2Bond Adhesive Solution, simply click below.